METHOD AND STRUCTURE FOR INHIBITING EXTERNAL DIFFUSION OF DOPANT

摘要

A method for inhibiting out-diffusion of dopants from polycrystalline or single crystal silicon substrates (12) of high speed semiconductor devices into metal silicide conductive layers disposed on the substrate comprises interposing a refractory metal nitride layer (18) between the doped silicon substrate (12) and the refractory metal silicide conductive layer (20). Dopant out-diffusion is further retarded, and contact resistance lowered, by adding a thin layer (16) of refractory metal between the refractory metal nitride layer (18) and the silicon substrate (12). <IMAGE>