| 摘要 |
<p>1. Heat sink for transferring heat between a semiconductor chip and a cooling device, comprising a heat transfer fluid disposed between and in contact with said chip and said device, characterized in that : the fluid consists of magnetic particles suspended in a carrier, and the cooling device is provided with an element that creates a magnetic field acting on the fluid, the pattern of the flux lines of the magnetic field being such that it keeps the fluid in place.</p> |
