| 摘要 |
PURPOSE:To improve the reliability of mounting without damage of a thin portion by a bending stress due to clamping of a screw at mounting time by forming a groove interrupted by a thick rib at both ends at a header main surface side package to partition a chip fixing side and a screw inserting hole forming side. CONSTITUTION:A package 2 made of resin is formed with a limited groove 9 at both ends in the intermediate. The groove 9 is formed along the widthwise direction of the package, and formed at the position to partition between a chip mounting (chip securing) region and a region formed with a screw inserting hole. The both ends of the groove 9 are formed thickly in the same manner as a chip mounting region, and a rib 12 is formed as a reinforced member. A screw inserting hole 4 is formed substantially at the center of the package portion 10 with screw mounting side. Thus, even if the screw is strongly clamped at mounting time of a power transistor, the resin is not crushed by the clamping force, not separated, thereby enhancing the reliability of mounting. |
