发明名称 LEAD FRAME
摘要 PURPOSE:To prevent tab short-circuiting by a method wherein at least the innermost portion of an inner lead is located higher than a pellet-fixing portion to provide a sufficient distance between a wire loop and the pellet fixing portion. CONSTITUTION:A lead frame 1 is so bent upward that the innermost end of the inner portion 2 of the lead frame 1 may be located higher than the other surfaces of the lead frame 1 by the quantity H and, further, higher than the height (h) of a tab 3 that is the location for a pellet 6 (H>h). The pellet 6 is attached by gold-silicon eutectic, silver paste, adhesive agent, or the like to the tab 3 of the lead flame 1. When the bonding pad for the pellet 6 and the elevated segment 2A of the inner lead portion 2 are bonded to each other with a gold or aluminum wire 7, a sufficient distance is provided between the wire loop and the tab 3, which prevents the occurrence of tab short-circuiting.
申请公布号 JPS615559(A) 申请公布日期 1986.01.11
申请号 JP19840125226 申请日期 1984.06.20
申请人 HITACHI OUME DENSHI KK;HITACHI SEISAKUSHO KK 发明人 KAGEYAMA JIYOUICHIROU;ASANO RIYOUHEI
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
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