| 发明名称 |
METHOD AND DEVICE FOR EASILY MOLD-RELEASING MOLDED SHAPE |
| 摘要 |
For facilitating the mold-release of insert-molded semiconductor packages, a thin coating of a nitride-comprising material on the working surfaces of the mold parts (1A, 1B) is provided which is effective in promoting mold-release without the necessity for special ejector apparatus and mold-release agents. Titanium nitride is especially suitable. |
| 申请公布号 |
JPS615905(A) |
申请公布日期 |
1986.01.11 |
| 申请号 |
JP19850044520 |
申请日期 |
1985.03.06 |
| 申请人 |
AA ESU EMU FUIKO TSUURING BV |
发明人 |
RICHIYARUDOSU HENRIKUSU YOHANESU FUIERUKENSU;IRENEUSU YOHANESU SEODORUSU MARIA PASU |
| 分类号 |
B29C33/38;B29C33/00;B29C33/60;B29K63/00;B29L31/34 |
主分类号 |
B29C33/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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