| 摘要 |
PURPOSE:To improve heat conducting characteristics from an IC chip to a heat sink, by inserting heat connectors, in which heat conducting fiber is implanted in resilient sheets, between chip carriers and the heat sink under the compressed state. CONSTITUTION:Many chip carriers 3 are connected and arranged on a wiring substrate 1 through a solder bonding part 2. Heat connectors 5, in which heat conducting fiber is implanted in resilient sheets, are inserted between the chip carriers 3 and a heat sink 4 under the state the heat conducting fiber is compressed to the degree the fiber is bent. The heat conductor 5 is formed by embedding many beryllium copper thin wires 18, which are the conducting fiber, in silicone rubber 17, which is a relatively soft insulating material. The connector form an excellent heat conducting path between a chip carrier cap 16 and the heat sink 4. Since the heat sink 4 and the chip carriers 3 are not fixed, stress of expansion and contraction due to temperature difference is not applied between the chip carriers 3 and the wiring substrate 1. Therefore, the connection of the chip carriers 3 and the wiring substrate 1 can be ensured. |
