METHOD AND APPARATUS FOR INJECTION MOLDED FLIP CHIP ENCAPSULATION

摘要

The electrical connections of an integrated circuit chip assembly (12) comprised of an intergrated circuit chip (20) attached to a substrate (14) are encapsulated and reinforced with a high viscosity encapsulant material (40) by dispensing the encapsulant material (40) through an opening (26) in the substrate (14) into the space between the integrated circuit chip (20) and the substrate (14). An integrated circuit chip assembly (12) having a reinforced electrical interconnection which is more resistant to weakening as a result of stress created by differences in coefficient of thermal expansion between the integrated circuit chip (20) and the substrate (14) to which the integrated circuit chip (20) is attached is produced.