发明名称 PROCEDE POUR CONTACTER DES COMPOSANTS A SEMICONDUCTEURS ET LIAISON ELECTRIQUE REALISEE A L'AIDE DE CE PROCEDE
摘要 A method of contacting an electrical component (particularly a semiconductor component) by means of a contacting wire (6) to a connecting member (2), wherein the connecting wire is connected in form- locking manner by pinching, clamping or wedging. The wire may be pinched, clamped or wedged in a cut or groove (7) in a surface of the member (2) by the application of force (8, 9) to the sides of the cut or groove (7), or between the member (2) and a folded- over part thereof. The contacting wire (6) is preferably pinched so as to produce a cold weld to the member (2). <IMAGE>
申请公布号 FR2487578(B1) 申请公布日期 1986.01.10
申请号 FR19810014257 申请日期 1981.07.22
申请人 SIEMENS AG 发明人 HANS-HELLMUTH CUNO, ALBERT HEIDER ET GUNTHER WAITL
分类号 H01L21/60;H01L21/603;H01R4/02;H01R4/18 主分类号 H01L21/60
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