发明名称 BRAKING ROLLER OF SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To eliminate adhesion to a sheet, to brake a wafer without attachment of the sheet to the rollers without excessive force, and to reduce the occurrence of breakdown and flaws at the time of braking as a result, by providing an irregular pattern on the compressing surface of a roller. CONSTITUTION:After dicing of an element, many grooves 8, 8... are provided in a compressing surface 5a of a braking roller 5, which compresses a wafer 2. An inrregular pattern is formed on the surface of the roller. When this roller is used, the compressing force to the sheet is obtained by the convex parts. Air is present in a part between the concave parts and the sheet. Therefore, the sheet is not sucked by the roller surface. Thus the occurrence of the breakdown and flaws due to the adhesion of the braking roller and the sheet can be eliminated.</p>
申请公布号 JPS614241(A) 申请公布日期 1986.01.10
申请号 JP19840124745 申请日期 1984.06.18
申请人 KIYUUSHIYUU NIPPON DENKI KK 发明人 HONDA TAKASHI
分类号 H01L21/301;B28D5/00;H01L21/304 主分类号 H01L21/301
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