| 摘要 |
PURPOSE:To implement high density in a driving circuit, by providing a sensor substrate comprising a photoelectric conversion element, separately providing a driving substrate comprising a driving circuit, which drives said photoelectric conversion element, and forming the wirings and the like of respective substrates by thin films. CONSTITUTION:On a first ceramic substrate 1, a common electrode 2 and an individual electrode 5 are formed. On the individual electrode 5, a photoelectric conversion element with a P-I-N junction is formed with a thin film. A light transmitting common electrode 4 is formed on the photoelectric conversion element 3 and the common electrode 2. On a second ceramic substrate 8, a photoelectric-conversion-element driving circuit comprisin the following parts are formed by thin films: a driving IC6 for driving the photoelectric conversion element 3; an individual electrode 501, which is wire-bonded to the driving IC6; and a common electrode 201. Since the sensor substrate and the driving substrate are separately formed and connected, the yield rate is improved. |
