发明名称 PARTIAL PLATING DEVICE
摘要 PURPOSE:To perform effective partial plating of a necessary part without deforming a protruded part, by forming a back holding plate so that only a part corresponding to a protruding part viewed from the side of the back holding plate is made soft and the other part has hardness required for sealing action. CONSTITUTION:In a back holding plate 40, a hard rubber plate 44, in which a through hole having a specified size is provided at the center, is attached to a substrate 42. A soft rubber plate 46 is coupled into the through hole provided. The soft rubber plate 46 is provided over an area corresponding to the protruded part of a stage part 10 when viewed from the side of the back holding plate 40. In this case, a material to be plated 22 is a lead frame 8 having the stage part 10, which is liable to deform. When the back holding plate 40 is pushed to the stage part 10, the rubber plate is indented and the protruded part of the stage part 10 is absorbed without deformation. The part of the hard rubber plate 44 is contacted with a lead part 12 of the lead frame 8 from the back surface. Thus the part other than the plating area of the lead frame 8 can be suitably sealed.
申请公布号 JPS614260(A) 申请公布日期 1986.01.10
申请号 JP19840125840 申请日期 1984.06.18
申请人 SHINKOU DENKI KOGYO KK 发明人 NISHIJIMA YOSHITAKA
分类号 C23C18/16;C23C18/31;C23C18/44;H01L21/48;H01L23/50 主分类号 C23C18/16
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