| 摘要 |
PURPOSE:To prevent the deviation of a cap from the specified position and to prevent the scattering of a sealing member for bonding in a package when the cap is bonded to the main body of the package, by forming a protruded part on one surface (on the side of the package) of the cap. CONSTITUTION:In a semiconductor package, the deviation of the position of a cap at the time of bonding to a package can be prevented by the protruded part of the cap 2 on the main body side of the package 1. The scattering of a sealing member 3 into the package can be prevented by said protruded part. |
