发明名称 SOCKET FOR SEMICONDUCTOR CHIP PERFORMANCE TESTER
摘要 PROBLEM TO BE SOLVED: To touch and fix a contact to a land pattern formed on a PCB without soldering by providing a contact to be mounted on the surface of the land pattern with elasticity in the vertical direction. SOLUTION: A contact 202 which is mounted on the surface of a land pattern 211 formed on a printed circuit board 210 an formed to have elasticity in the vertical direction is fabricated by being inserted into a housing 201. In this case, the end 203 of the contact 202 is molded into a projected square shape or into a hook-shape, namely, a J-shape, so as to facilitate its contact with the land pattern 211. The contact 202 is thus mounted on the surface of the land pattern 211 formed on the printed circuit board 210 and can touch the land pattern 211 without being soldered to the printed circuit board 210 nor using a separate-body receptacle, so that this constitution can prevent the occurrence of a short circuit, etc., caused by the soldering.
申请公布号 JPH11233218(A) 申请公布日期 1999.08.27
申请号 JP19980035806 申请日期 1998.02.18
申请人 SAMHO ENG CO LTD 发明人 SHIN MEIJUN
分类号 G01R31/26;H01L23/32;H01R33/76 主分类号 G01R31/26
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