发明名称 |
SOLDERING METHOD OF PINS TO EYELETS OF CONDUCTORS FORMED ON A CERAMIC SUBSTRATE |
摘要 |
This method of bonding the heads of connecting pins previously inserted in a ceramic substrate to the eyelets of conductors formed on the top surface of said substrate comprises the steps of: applying a droplet of flux to the head of each pin; applying a solder ball to the head of each pin where it is held in position because of the adhesive capacity of the flux; heating in a furnace containing a nitrogen atmosphere and having a peak temperature of 350 DEG C. to cause a solder reflow; and allowing to cool to enable the solder to set and to provide a permanent electrical and mechanical bond between the head of the pins and the eyelets. This method is suitable for use in manufacturing electronic modules employed in computers. |
申请公布号 |
DE3173078(D1) |
申请公布日期 |
1986.01.09 |
申请号 |
DE19813173078 |
申请日期 |
1981.12.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;COMPAGNIE IBM FRANCE |
发明人 |
BITAILLOU, ALEX;LEMOINE, JEAN-MARIE;MASSON, JEAN |
分类号 |
H01L23/50;B23K3/06;H01L21/48;H01L21/60;H01L23/12;H01R43/02;H05K1/03;H05K3/34;(IPC1-7):H01R43/02 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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