发明名称 MOLD FOR SEALING WITH TRANSPARENT RESIN
摘要 PURPOSE:To obtain the high-quality semiconductor device by preventing generation of mold cavity in the resin-sealed body by determining a gap formed between a transparent resin tablet and an inner wall of pot to be within a specified range so as to reduce a quantity of air involved into the gap at processing. CONSTITUTION:A transparent resin tablet 21 put in a pot 20 is contrived to be driven into a mold by a plunger 23 which moves up and down in the pot 20 through a runner 22. At this time, an internal diameter L3 of the pot 20 is determined to be 1-2mm. larger than an external diameter L2 of the transparent resin tablet 21 to be put into. If the gap is under 1mm., an operation of putting the tablets 21 becomes difficult and if the gas is over 2mm., a quantity of air involved in the resin increases.
申请公布号 JPS613416(A) 申请公布日期 1986.01.09
申请号 JP19840123108 申请日期 1984.06.15
申请人 TOSHIBA KK 发明人 MIYAMOTO MITSUGI
分类号 B29C45/02;B29C45/14;B29C45/46;B29K105/32;B29L31/34;H01L21/56 主分类号 B29C45/02
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