发明名称 METHOD OF INJECTION MOLDING
摘要 PURPOSE:To obtain an electromagnetic shielding molded item free from molding strain wherein the appearance, electroconductivity, electromagnetic shielding property, and electrical property are excellent, and the adhesion between the layers is good, by retaining a primarily molded item of a thermoplastic resin containing a conductive filler to a temperature in the range between 100 deg.C and 200 deg.C, while injection molding a melted thermoplastic resin onto the surface of the item. CONSTITUTION:A material made up of 100pts.wt. thermoplastic resin and 20 to 200pts.wt. electroconductive filler is injection molded onto a core section 1a to form a primarily molded item 2. The temperature is cntrolled by a heater built in the injection mold in such a way that the primarily molded item is at 100 deg.C to 200 deg.C, and a melt thermoplastic resin is injection molded onto the surface of the item 2 to form a thermoplastic resin layer. Thus, diffusion between the thermoplastic resin containing the filler and the surface thermoplastic resin occurs, the adhesion therebetween is substantially improved, and molding strain would not occur.
申请公布号 JPS612519(A) 申请公布日期 1986.01.08
申请号 JP19840083501 申请日期 1984.04.24
申请人 ARON KASEI KK 发明人 HASEGAWA TADASHI;HAGA KAZUO;IZUMO KAZUYUKI;SUGIE NOBUYOSHI;ENOMOTO KATSUYUKI
分类号 B29C45/14;B29C45/00;B29C45/16;B29K105/16;B29L31/34 主分类号 B29C45/14
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