Method of manufacturing semiconductor devices.

摘要

The preferred embodiment discloses a new method of manufacturing semiconductor devices, in which monocrystalline thin film is formed by dissolving and recrystallizing either amorphous or polycrystalline thin film (6) via annealing means by radiation of energy beams (9), wherein the manufacturing method comprises: the formation of a belt-shaped high melting point metal film (8) having a width narrower than the diameter of the energy beams on either amorphous or polycrystalline thin film; beam scanning in parallel with the said belt by means of radiating energy beams onto the said belt-shaped high melting point metal film; and generation of a nucleus in a limited area beneath the belt-shaped thin film at the moment the film-covered amorphous or polycrystalline area dissolves and recrystallizes so that the said recrystallized area can eventually grow into a moncrystalline configuration.