Sensitizing agent for electroless plating and method for sensitizing substrate with the agent.

摘要

A sensitizing agent for electroless plating, comprising a solution of at least one of palladium (II), silver (I), copper (I), copper (II), and nickel (II) compounds in an amide is used for sensitizing substrates made of plastics or ceramics by treating the substrate with the sensitizing agent, followed by treating it with a reducing solution.