发明名称 |
HEAT INSULATING STRUCTURES FOR LOW-TEMPERATURE OR CRYOGENIC PIPINGS |
摘要 |
<p>A heat insulating structure for low-temperature or cryogenic pipings (1), comprising at least one heat insulating barrier (3) and at least one moisture barrier (2) which are laid on the outer surface of a piping to be heat-insulated, and at least one sheathing layer (6), wherein said heat insulating barrier comprises an extruded styrenic resin foam and wherein, as expressed in terms of the three-dimensional coordinates X (circumferential direction), Y (thicknesswise direction) and Z (longitudinal direction), said heat insulating barrier has a Y-axial water vapor permeability Py of 1.5 g/m<2>.hr or less and at least the heat insulating barrier most adjacent to said piping has X-axial and Z-axial elongations at rupture Ex and Ez in the range of 8 to 40 percent.</p> |
申请公布号 |
WO8600122(A1) |
申请公布日期 |
1986.01.03 |
申请号 |
WO1984US00892 |
申请日期 |
1984.06.07 |
申请人 |
THE DOW CHEMICAL COMPANY;ASAHI CHEMICAL INDUSTRY CO., LTD |
发明人 |
NAKAMURA, MASAO;TONOKAWA, HIROSHI |
分类号 |
F16L59/02;F16L59/14;(IPC1-7):F17C7/02;F16L9/14 |
主分类号 |
F16L59/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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