SEMICONDUCTOR DEVICE

摘要

Semiconductor device is produced using an adhesive which is water- resistent and anti-corrosive. The composition of the adhesive is as follows; a solvent for both the epoxy resin and the novolac phenol resin, e.g. butyl cellosolve; a powder filler, e.g. silver powder; a hardener; and a coupling agent. The soln. is painted on the frame(2) and on the surface of the semiconductor device(3). The semiconductor device is laid on frame and heated to harden the adhesive. An elec. lead wire(5) connects the semiconductor device to the conductive material(1). All of these are installed in the resin body(6) by transfer molding.