发明名称 COMPOSITION AND PROCESS FOR CONDITIONING THE SURFACE OF PLASTIC SUBSTRATES PRIOR TO METAL PLATING
摘要 An alkaline composition for enhancing the adhesiveness of metal plating to a plastic substrate comprising: (a) a compound represented by general formula (I), and (b) a compound represented by general formula (II), wherein R1, R2, R3, and R4 are independently selected from the group consisting of hydrogen atoms, aryl groups and alkyl groups of 1-4 carbon atoms, m is 0 to 2 and n is 2 to 5; the compositions comprising, by weight, about 10 gram/liter (g/l) to saturation compound (a) and about 10g/l to saturation compound (b). The composition is preferably employed before alkaline permanganete etching of the plastic, followed by electroless metal plating using conventional techniques.
申请公布号 AU4356885(A) 申请公布日期 1985.12.31
申请号 AU19850043568 申请日期 1985.05.08
申请人 ENTHONE, INCORPORATED 发明人 DEL GOBBO, ANTHONY R.
分类号 H05K3/18;C23C18/18;C23C18/20;C23C18/22;H05K3/00;H05K3/38;H05K3/42;H05K3/46 主分类号 H05K3/18
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