| 摘要 |
<p>1. Process for automatically manipulating wafers (5, 5', 2, 2', 8, 8') in the form of flat circular discs for the purpose of successively offering the wafers at a station for marking by laser ray (7), comprising the following steps : a) said wafers are aligned one behind the other in vertical, parallel planes and maintained in a support (1) ; b) the support (1) is brought to a work station comprising means (3, 3') for wedging the support in determined position and such that the parallel planes of the vertically aligned wafers are substantially perpendicular to the axis of projection of the marking laser ray (7) ; (c) the wafers are displaced successively between a frontal position located in the field of the marking laser ray and a position cleared with respect to this ray ; d) on the one hand the wafers (5, 5') aligned together or on the other hand the source of emission of the marking laser ray (7) are displaced step by step one with respect to the other so as, after each operation of marking of a wafer and clearance of this wafer (2) in the preceding movement (c), to bring a new, non-market wafer (2') in position for receiving the marking ray (7).</p> |
