发明名称 MIRROR POLISHING METHOD OF ELECTRONIC PARTS
摘要 PURPOSE:To prevent a material to be polished from generating a surface flaw due to direct contact of the material to be polished with a supporting plate, by interposing an interposition material, having familiarity as a bonding agent, in a thermoplastic bonding agent between the material to be polished and the supporting plate. CONSTITUTION:An interposition material 5 of thin paper or the like, containing paraffin and being permeated by a bonding agent 4, is placed on the thermoplastic bonding agent 4 of paraffin, wax, etc. dissolved on a supporting plate 1, and a substrate 2, after it is placed on the bonding agent 4 with an already mirror polished surface 2b positioning toward a side of the interposition material 5, is adhesively attached to the supporting plate 1 by heating the bonding agent 4. Here the substrate 2 is surely secured to the supporting plate 1 interposing the interposition material 5 because the bonding agent 4 permeates into the interposition material 5 seeping to a side of the surface 2b of the substrate 2. Under this condition, the substrate 2, if its surface 2a is mirror polished by 180 deg. rotating the suporting plate 1, is not directly brought into contact with the supporting plate 1 even for large force applied to the substrate 2 from the supporting plate 1, enabling the surface 2b to be prevented from generating a scratch.
申请公布号 JPS60263667(A) 申请公布日期 1985.12.27
申请号 JP19840120356 申请日期 1984.06.11
申请人 MURATA SEISAKUSHO:KK 发明人 OGAWA TOSHIO
分类号 B24B1/00;B24B7/22;B24B37/04;B24B37/30;B24B41/00 主分类号 B24B1/00
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