DENSE DYNAMIC MEMORY CELL STRUCTURE AND MANUFACTURING PROCESS

摘要

A dynamic memory is provided having a cell with an improved structure and made by an improved process which substantially reduces the capacitance of the bit/sense line connected to the cell. The cell has one field effect transistor and a storage node, and the cell structure includes a thick insulating segment located under a portion of a conductive layer or field shield and under a portion of the gate electrode of the transistor, while extending over the entire diffusion region of the bit/sense line and over substantially the entire depletion region surrounding the bit/sense line diffusion region.