发明名称 SYSTEM FOR ACQUIRING AND MANAGING WAFER MANUFACTURING DATA
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor processing apparatus, provided with at least one sensor and a tool, having a first data communication port and a second data communication port. SOLUTION: A sensor data acquiring subsystem (808) acquires sensor data from the tool via a second port (806). The data-acquiring subsystem (808) acquires an MES operation message via a first port (804). The sensor data are communicated to a sensor processing unit (828) of a sensor data processing subsystem (810). The sensor processing unit (828) processes and analyzes the sensor data. Furthermore, the processing unit (828) can be suited to determine a product or processing relation, such as to operate an alarm, when a process is not operated within a management limit, for example. In another embodiment, a method and a device are provided for processing data from a wafer manufacturing facility (1000) provided with plural tools respectively, having first data communication ports (1012-1018) and second data communication ports (1042-1048).
申请公布号 JP2002015969(A) 申请公布日期 2002.01.18
申请号 JP20010129826 申请日期 2001.04.26
申请人 APPLIED MATERIALS INC 发明人 CORDOVA SHERRY;MICHAEL E WILLMER;NISHIMURA YUKARI;KROUPNOVA NATALIA;NOLET CLARICE M;DOYLE TERRY;LYON RICHARD C;LOBOVSKI EVGUENI;LOUNEVA INNA;TOH WOON YOUNG;REISS TERRY
分类号 H01L21/302;G05B19/042;H01L21/02;H01L21/205;H01L21/3065;(IPC1-7):H01L21/02;H01L21/306 主分类号 H01L21/302
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