| 发明名称 |
Material for printed circuit substrates. |
| 摘要 |
<p>A material for printed circuits is disclosed. The material consists of woven glass fiber cloth in which the warp is of plied yarn (12) and the fill is of unplied or twisted yarn (13) to facilitate more thorough polymeric resin impregnation and achieve improved dimensional stability.</p> |
| 申请公布号 |
EP0165524(A2) |
申请公布日期 |
1985.12.27 |
| 申请号 |
EP19850106818 |
申请日期 |
1985.06.03 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BHATT, ANILKUMAR CHINUPRASAD;DORAN, DONALD EDWARD;KNIGHT, JAMES WALLACE |
| 分类号 |
B32B15/08;B32B5/08;B32B15/14;B32B17/04;D03D1/00;D03D15/00;D03D15/12;H05K1/03;(IPC1-7):H05K1/03 |
主分类号 |
B32B15/08 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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