发明名称 METHOD FOR PLATING STAINLESS STEEL BAR
摘要 PURPOSE:To form a desired metallic layer with superior adhesion by plating when a stainless steel bar is continuously plated at a high speed, by forming an Ni layer by stricking in an Ni striking bath having a specified low concn. before plating. CONSTITUTION:A stainless steel bar is electrolytically degreased to clean to surface, and it is stcuck in an Ni striking bath contg. 150-180g/l NiCl2, 6H2O and 70-90ml/l 12N concd. hydrochloric acid at 15-30 deg.C and 10-30A/dm<2> cathode current density for 5-30sec. The resulting Ni layer is electroplated with a noble metal such as Ay or Ag, Sn, an Sn alloy or the like according to the purpose. Even in case of a stainless steel bar having a passive film on which a film with superior adhesion is difficult to form by plating, a desired metallic film with superior adhesion can be formed by this plating method at a high speed.
申请公布号 JPS60262994(A) 申请公布日期 1985.12.26
申请号 JP19840118350 申请日期 1984.06.11
申请人 TAKADA KENKYUSHO:KK 发明人 TAKADA KOUJI
分类号 C25D5/26 主分类号 C25D5/26
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