| 摘要 |
PURPOSE:To obtain a light-emitting diode aligned material having a good heat radiating property and easy to perform a common wiring and a lead-out of terminal by a method wherein plural monolithic light-emitting diodes, which are placed and fixed on part of the substrate, and multilayer wiring parts, which are provided on the same surface of the substrate excluding the placing part for the light-emitting diodes and the periphery thereof, are provided. CONSTITUTION:Single layer wiring layers 2 and 3 are provided on a substrate 1 of ceramics and so forth and monolithic light-emitting diodes, from which wirings are performed to the single layer wiring layers 3 using fine metal wires 5, are placed on the wiring layer 2. Driving elements 6, which are disposed on both sides of the diodes 4, control the lighting of the light-emitting diodes 4. Multilayer wiring parts 7 are provided at the peripheral edge parts only of the substrate 1. 64-128 pieces of aligned light- emitting points are formed on the light-emitting diodes 4, such as the elements having the length of 1-8mum and consisting of GaAsP, by a selective diffusion and the light- emitting diodes with the light-emitting points are disposed in the center of the substrate 1 as a monolithic type. According to this way, even when the light-emitting diodes are placed in high density, the heat radiation is good and the wiring is not damaged, and moreover, the degree of sufficient freedom in a wiring to the common wiring and the terminal part can be obtained. |
