| 摘要 |
<p>PURPOSE:To reduce points of connection by a construction wherein a semiconductor element is mounted directly on a resin film having leads and the end of one of the leads is connected to an electrode on an insulating substrate. CONSTITUTION:A substrate 19 has a construction in which Cu-leaf patterns 21 and 21' are stuck on a resin film 20 and in which an opening 22 is formed in a region for connecting a semiconductor element 1. In the opening 22 the leads 21 and 21' of a wiring pattern are projected and extended, and one end of the lead 21 is joined to an electrode of the element 1, while the other end thereof is extended continuously to the region of an electrode 12 of a display panel 10. A projection 15 is formed on the electrode of the element 1, and this projection 15 is joined to the leads 21 and 21'. The electrode 12 of the panel 10 and the lead 21 are connected in such a manner that an organic bonding material 24 is interposed between them to make them contact with each other under pressure and fixed. Setting is made by a photosetting method. A region of junction of the film 20 and the electrode 12 is covered with photosetting resin 25, and a light is applied 26 thereto for setting.</p> |
