| 摘要 |
PURPOSE:To prevent the defect of short circuits even when a semiconductor light emitting element is made thin, by forming a recess with respect to an element mounting surface of a conducting frame, and limiting the amount of injection of a conducting paste to a degree where the upper part is slightly higher than the height of the element mounting surface. CONSTITUTION:At the central part of an element mounting surface 22 of a conducting frame 21a, a recess 23, whose diameter is smaller than a semiconductor light emitting element 11, is formed. Thereafter, plating tratment is performed, and a mirror-surface reflecting plate 17 is formed. A conducting paste 14, which is injected in the recess 23, is adjusted and injected so that the upper part slightly exceeds the element mounting surface 22. A semiconductor light emitting element 11 is mounted on the upper part of the conducting paste 14. They are dried at a high temperature, bonded and fixed. Thereafter, the semiconductor light emitting element 11 and the conducting frame 21b are connected by a piece of metal wire 15. The device is sealed in a resin lens 16 by using a resin. |
