| 摘要 |
A heat activatable adhesive or sealant organic resin composition comprising (1) an epoxy resin containing at least two <IMAGE> (2) a thermal initiator selected from the group consisting of diaryliodonium salts and diaryliodonium salts combined with a pinacol, and (3) a thermoplastic adhesive material selected from the group consisting of polyesters, polyvinyl acetals, polyamides, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, styrene-isoprene copolymers, styrene-ethylene-butylene copolymers, ethylene-vinyl acetate copolymers, ethylene-ethyl acrylate copolymers, ethylene propylene diene monomer and mixtures thereof. The composition after application to the parts to be bonded or sealed forms a thermoset bond or seal on application of heat thereto, preferably by electromagnetic techniques including dielectric and induction heating.
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