| 摘要 |
An arrangement is disclosed for the galvanic deposition of metal at relatively greater speed and with controllable layer-thickness distribution, of the type composed of an electrolysis tank with overflow, electrodes, nozzles, connecting conduit tubes, pumps, control system means and dosaging system means as well as electrical appurtenances, wherein a cathodically-connected work piece to be galvanized is arranged between two nozzles which are each formed from two chambers located one above the other and having separate entrance and exitways, the upper chamber contains an electrolyte exit opening provided as a longitudinal slit and the lower chamber defines an anode niche displaying at the height of the slit a vertically-adjustable opening. Also disclosed is a method for the electrolytical deposition of metal, employing substantially the abovedescribed arrangement and particularly for depositing nickel- or gold-coatings on plug contacts of printed circuits.
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