| 摘要 |
PURPOSE:To prevent the yield of cracks in a sealed substance due to burr, by chamfering the side edge of an inner lead on the side, where the burr is yielded by press machining. CONSTITUTION:A drawn part of an outer lead 14, which is pulled out of a sealed part 11, i.e., a side edge 15 of an inner lead 12 in the vicinity of a boundary part with the outer lead part 14, is chamfered. In this constitution, when a semiconductor element is mounted on a lead frame 10 and resin sealing is performed, the yield of cracks in the sealed substance due to remaining burr on the side edge of the lead 12 can be prevented. |
