| 摘要 |
PURPOSE:To mount a large semiconductor chip, by shifting the surface of a bed, on which a semiconductor chip is mounted, from the plane of inner leads, making the interval between both surface in a plane zero, thereby increasing the area of the bed. CONSTITUTION:The surface of a bed 21, on which a semiconductor chip is mounted, is shifted from a plane formed by inner leads 24 by an interval (d). The interval between the inner leads 24 and the bed 21 is made to be zero in a plane. Therefore, a width P of the bed 21 can be made large in comparison with the width of a conventional bed, and the chip to be mounted can be made large. When the width P of the bed 21 is made intact as the conventional width, a size Q of each lead 24 can be made large conversely. Therefore, adhesion strength between a molding resin and the leads 24 can be improved. |
