PROCESS OF MANUFACTURING PRINTED WIRING BOARDS AND PRINTED WIRING BOARDS MANUFACTURED BY THE SAME

摘要

TITLE OF THE INVENTION PROCESS OF MANUFACTURING PRINTED WIRING BOARDS AND PRINTED WIRING BOARDS MANUFACTURED BY THE SAME A printed wiring board of this invention can be obtained by the steps of: making holes in the necessary portion of a copper-clad laminate; forming a catalytic layer on said hole walls and copper foil by pretreatment for electroless plating; forming an etching resist film on necessary lands and circuits; melting-off the copper foil and catalytic layer on the unnecessary portion of said copper-clad laminate by etching; melting off or retaining said etching resist film; and forming an electroless copper plated film on said catalytic layer; or forming a solder resist film on the necessary portion before or after said electroless copper plated film is formed.