| 摘要 |
PURPOSE:To reduce the thermal resistance of a semiconductor laser to a large extent by utilizing the spreading effect of heat, by attaching a small mounting substrate to a metallic heat sink so as to hold a semiconductor laser chip as an intermediate medium with respect to the positive and negative electrode surfaces of the semiconductor laser chip. CONSTITUTION:A lead terminal 10 is attached to a copper heat sink 8 consituting the main body of a package through a sintered alumina body 9. A laser chip 1 is soldered to sub mount 13 having heat conducting property beforehand. Said sub mount 13 is soldered to the heat sink 8. Then a metal layer 20, which is formed on the upper surface of the sub mount 13 is connected to the lead terminal 10 by using a gold wire 14. A conducting sub mount 15 having heat conducting property is soldered to a copper block 16 beforehand. The copper block 16 is mounted in alignment with a guide surface 17, which is provided on the heat sink 8. The block 16 is moved, and a solder layer 24, which is provided on the upper surface of the sub mount 15, is contacted with the laser chip 1. |
