RESIN BOND WIRE SAW

摘要

PROBLEM TO BE SOLVED: To improve wire saw sharpness better by forming a spiral for improving supply of grinding fluid and evacuation of chips on a peripheral surface of a resin bond wire saw. SOLUTION: The wire saw 10 comprises a core wire 1 whose peripheral surface with the application of an adhesive 1a is wound with the spiral of a filament 2 wherein an abrasive grain layer 2b comprising diamond abrasive grains bonded with a phenol resin is formed on an outer surface of a piano wire 2a. The filament 2 projects from the peripheral surface of the core wire 1 and spirals on the core wire 1 to cause the projection to form the spiral. Grinding fluid is supplied and chips are evacuated along the spiral, so that the supply of grinding fluid and the evacuation of chips are improved to improve the sharpness of the wire saw 10.