| 摘要 |
PROBLEM TO BE SOLVED: To provide a hollow resin mold type surface acoustic wave(SAW) filter wherein attenuation in a high frequency region is large, productivity is improved while miniaturization and weight reduction are realized, and the cost can be reduced. SOLUTION: A piezoelectric substrate chip is sealed in a package formed of resin, and an impedance matching circuit constituted of circuit element chips such as inductance (L), electrostatic capacity (C) and resistance (R) is arranged to the piezoelectric substrate chip and sealed in the same package formed of resin. In addition to the piezoelectric substrate chip and the impedance matching circuit accompanying with the chip, a transistor, a switching element, etc., which are peripheral elements of the chip and the circuit are sealed in one package formed of resin. |
