| 摘要 |
PURPOSE:To prevent deformation of lead frame by one kind of glass which is hard to fuse again after sticking the lead frame by printing two kinds of sealing glass on an upper surface in periphery of a cavity part. CONSTITUTION:Two kinds of sealing glass 31 and 32 is printed on an upper surface in periphery of a cavity part 2 where a semiconductor chip of a ceramic base 1. The glass 31 is crystalline and the glass 32 is amorphous. Because the crystalline glass 31 fused at a time when the lead frame is stuck is hard to fuse in the later process of heat treatment, sealing with a cap is effected by the amorphous glass 32 with fixing the lead frame firmly. Deformation of the lead frame does not occur at sealing with a cap and the fused glass does not flow into the cavity part, thereby enabling high-reliability cap sealing and die bonding. |
