| 发明名称 |
Method and apparatus for adhesively bonding an adhesive tape to a thin article |
| 摘要 |
Method for adhesively bonding an adhesive film to a thin article, such as a silicon wafer. The adhesive films 12, adhesively bonded to a sheet 11 coated with a release agent are released from the sheet by bending the sheet at an acute angle or by applying a suction force. The adhesive film thus released is adhesively bonded to the article 16, in correct alignment. <IMAGE>
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| 申请公布号 |
FR2565949(A1) |
申请公布日期 |
1985.12.20 |
| 申请号 |
FR19840009374 |
申请日期 |
1984.06.15 |
| 申请人 |
NITTO ELECTRIC INDUSTRIAL CO LTD |
发明人 |
KEIGO FUNAKOSHI, KOZO NOMURA, MINORU AMETANI ET KENJI OHNISHI;NOMURA KOZO;AMETANI MINORU;OHNISHI KENJI |
| 分类号 |
B65C1/02;B65C9/36;B65H37/04;(IPC1-7):B65H37/04;B65B33/02;C09J5/00;C09J7/02;H01L21/70 |
主分类号 |
B65C1/02 |
| 代理机构 |
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代理人 |
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| 地址 |
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