| 摘要 |
<p>PURPOSE:To enable miniaturization, cost reduction, and assembly simplification by a method wherein a hybrid IC with at least one of a light emitting element and a photo transmitter circuit or a light receiving element and a photo receiver circuit formed integrally to the surface of a substrate is sealed with a package, and the other end is connected to the electric circuit of the hybrid IC. CONSTITUTION:Lead terminals 11 are installed to a stem 10 made of insulator with both end projected out of the upper and lower surfaces. A photoelectric conversion circuit on the substrate of a hybrid IC 12 with this circuit integrally provided on the upper surface side of the substrate which has nearly the same size as that of the upper surface of the stem and holes 12a in the periphery into which one end of the terminal is inserted is, in the case of the photo transmitter device, composed of printed circuits 12b connected to the holes 12a, LED chips 12c provided thereon, driver IC chips 12d, printed resistors 12e, and the like. On the other hand, in the case of the photo receiver device, that circuit is composed of printed circuits, PD chips, amplifying circuits, comparators, etc. This hybrid IC 2 can have a plurality of transmitter circuits or receiver circuits on one substrate, and it is also possible to provide a transmitter circuit and a receiver circuit integrally on one substate.</p> |
