| 摘要 |
PURPOSE:To obtain a high molecular material having high electric conductivity by bonding copper sulfide to the surface of a high molecular material and depositing an electrically conductive metal through the copper sulfide. CONSTITUTION:About 1-5wt% (expressed in terms of metallic copper) copper sulfide is bonded to the surface of a high molecular material having at least one kind of active group bonding to a copper ion such as cyano, mercapto or thiocarboxy, and an electrically conductive metal is deposited by electroplating through the copper sulfide. Ni, Cu, Co, Pb, Zn, Sn or the like are used as the electrically conductive metal and deposited by about 10-80wt% of the amount of the high molecular material. The specific resistance of the high molecular material having bonded copper sulfide is reduced from 1-0.1OMEGA.cm to about 10<-3>-10<-5>OMEGA.cm. |
