| 摘要 |
PURPOSE:To prevent external leads from being in contact with an external substance easily and being rubbed by forming the external leads on a back surface of main body of package in the position which is depressed compared with the main plane of back surface. CONSTITUTION:In the chip carrier type ceramic package of leadless type, an external lead 3 drawn out on a back surface 4 from a bonding pad through a side surface of a package base 1 is led into a groove 5 arranged on the back surface 4. Even if the package is slided on a transportation rail with the back surface down, the external lead 3 is not rubbed. Then the trouble that the external leads are rubbed to be detached at automatic mounting or other treatments is eliminated and a contact failure based on the detachment damage of external leads is not produced. |
