| 摘要 |
PURPOSE:To produce the titled adhesive containing decreased amount of gold and silver and having excellent eletrical properties and adhesive strength, by plating the surface of the fine powder of iron, copper, nickel, etc. with a noble metal, and mixing the plated powder with an adhesion resin. CONSTITUTION:A metal such as iron, copper, nickel, etc. is finely pulverized and the surface of the powder is covered with a noble metal such as gold, silver, etc. by electroplating or electroless plating. The plated power is mixed with an adhesive resion such as epoxy resin to obtain the objective adhesive. The amount of the powder is selected to give a bulk specific gravity of the gold or silver of preferably 30-40%. |
