| 摘要 |
PURPOSE:To prevent the crack and peeling of a cover body due to a difference between thermal expansion coefficients by interposing a flexible film between an opening end in a package proper and the cover body sealing the opening end. CONSTITUTION:A semiconductor chip 8 is bonded with one surface of a die pad 6, and the semiconductor chip 8 and leads 7 are connected by bonding wires 9. The die pad 6 is turned over, and a thermosetting resin 10a is attached lightly and placed so as to be in contact with the whole surface of the other surface of the die pad 6 and be positioned in clearances among the leads 7 and the die pad 6. The whole is inserted into a cavity 19, in which an inert gas is introduced, between a die consisting of heated top force 17 and bottom force 18. The resin 10a in a prepreg 16 is softened by the effect of the heat of the die, is pushed out from the clearances among the die pad 6 and the leads 7, and reaches to a cover body 12 consisting of silica glass, which is placed on the bottom force 17 and on which a flexible film 13 is attached, the inert gas is confined among the die pad 6, the cover 12 and the reaching resin, and the resin under a softened state is cured, thus forming a first structure 10. |
