| 摘要 |
PURPOSE:To prevent the generation of movable residue in a first bonding pad due to etching on the formation of a second bonding pad by coating the first bonding pad with the second bonding pad, which must be superposed on the first bonding pad. CONSTITUTION:In a device with a first bonding pad formed onto the required section of the surface of an insulating film shaped onto the main surface of a semiconductor substrate and a second bonding pad formed so as to be superposed to the first bonding pad, the generation of movable residue in the first bonding pad due to etching on the formation of the second bonding pad 6b can be prevented because the second bonding pad 6b is shaped so as to coat the first bonding pad 3, thus resulting in no adhesion onto a wiring film of residue, then improving the yield of products. |
