| 发明名称 |
THERMOSETTING RESIN COMPOSITION |
| 摘要 |
Workability of polyaminobismaleimide resin composition is improved by using an epoxy group-containing vinyl compound to obtain a solvent-free resin composition. Particularly, combined use of an epoxy group-containing vinyl compound and an epoxy resin depresses cure shrinkage to improve dimensional stability and appearance of cured moldings. |
| 申请公布号 |
WO8505625(A1) |
申请公布日期 |
1985.12.19 |
| 申请号 |
WO1985JP00292 |
申请日期 |
1985.05.28 |
| 申请人 |
MITSUI PETROCHEMICAL INDUSTRIES, LTD. |
发明人 |
KAMEYAMA, MASAO;TOMINAGA, KAORU;TAKEDA, NOBUYUKI;IWATA, TADAO |
| 分类号 |
C08G59/00;C08G59/18;C08G59/40;C08G73/12;C08L63/00;(IPC1-7):C08G73/12 |
主分类号 |
C08G59/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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