| 摘要 |
<p>An electronic component heat sink comprising a base metallic plate (10) to which one or more electronic components (18, 20 and 22) are affixed. The base plate (10) is formed into a plurality of planar surfaces (12, 14 and 16) such that each electronic component (18, 20 and 22) remains flushly mounted to one of the planar surfaces (12, 14 and 16). The electronic components (12, 14 and 16) are usually flow soldered to the base plate (10) when the base plate (10) is in a single plane. The plate (10) is then bent to form the plurality of surfaces (12, 14 and 16). A second plate (24) can be flushly mounted against the base plate (10). The second plate (24) has planar surfaces (26, 28 and 30) correspnding to those of the formed base plate (10). The second plate (24) also usually has a plurality of fins (32, 34 and 36) extending from its side opposite from the side contacting the base plate (10).</p> |
