Lot-to-lot feed forward CMP process

摘要

One embodiment disclosed relates to a chemical-mechanical polishing process. The process includes performing chemical-mechanical polishing on an entire wafer lot without look ahead polishing of a first article wafer. A normalized polish rate is determined, and a process time for a next wafer lot is predicted using the normalized polish rate. Another embodiment of the invention relates to a polishing apparatus for chemical-mechanical planarization of semiconductor wafers.