| 摘要 |
Planarizing machines for chemical-mechanical planarization of microelectronic substrate assemblies are disclosed. The planarizing machines for processing microelectronic substrate assemblies generally include a table, a pad support assembly either positioned on or in the table, and a planarizing medium coupled to the pad support assembly. The pad support assembly includes a fluid container and an elastic membrane coupled to the fluid container. The fluid container generally is a basin that is either a separate component that is attached to the table, or a depression in the table itself. The fluid container can also be a bladder attached to the table. The fluid chamber is filled with support fluid to support the elastic membrane over the fluid chamber.
|
